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| MSR |
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| The Panasert MSR is a multifunctional high-speed placement machine with six types of nozzles providing fast, accurate mounting of components ranging from 0603 (0201) microchips to 32mm QFP's at a high speed of 0.08 sec/piece. The new direct drive and the new recognition system improve quality and productivity, creating a versatile system capable of mounting BGA's and CSP's as well as providing for future expansion of component types. |
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| High Productivity |
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The new parts feeder can be attached or removed with a single action, and used for paper/embossed tapes and M/XL sizes, facilitating management. |
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The drive with an oil bath enables high-speed operation and easy maintenance. |
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The double feeder system can take up to 300 component inputs. |
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| Fast high-density placement of large to small components |
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The X-Y table moves ± 12 mm (within a scope of 24 mm x 24 mm) in 0.08 second. |
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High-speed placement of medium to large components: 0.11 second for a 28-pin SOP. |
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Maximum speed of 0.08 sec/piece for 510 mm x 460 mm large PC boards. |
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Features a 6-nozzle, 16-head system rotary head. The independent drive nozzle unit and compact lightweight Harmonic Drive ensure high quality and reliability. |
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| More accurate placement of microchips, BGA's and CSP's |
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Combination of reflective and transmissive recognition systems and new coaxial lighting technology provide accurate placement of components from 0603 (0201) microchips to 32 mm QFP's. |
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Thanks to the one million-pixel recognition camera, all-ball detection of fine-pitch QFP's, BGA's and CSP's is also possible. |
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| MSF |
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| the Panasert Msf is a high-speed multifunctional placement machine providing fast, accurate mounting of components ranging from 0603 (0201) microchips to 55mm QFP's, CSP's, BGA's, bare IC's and insert connectors at a high speed of 0.094 sec/piece using a 2-head, 10-nozzle system. |
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| Top-level component versatility in the Industry |
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The recognition speed of 2D and 3D sensors has been doubled compared with the MPAV2. Vertical bending of all pins of QFP's, presence of balls of CSP's and BGA's, position and the height of a minute solder bump can be detected using the 3D sensor. |
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The high-speed tray supplier allows high-speed placement of tray-supplied, irregularly-shaped components such as large connectors, QFP's and SOP's. |
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Placement of bare IC's is possible by VCM (voice coil motor) head's placement pressure control up to 20N and pressure control of up to 0.1N. Pressured insertion of connectors up to 50N is possible with the 10-nozzle head. |
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| Uninterrupted operation |
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Tray suppliers component size 48 types (96 types 2 units installed) can also be added to the maximum component inputs of 192 (using the double feeder). |
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The new motor system parts feeder (excluding the 8mm type) allows the feed quantity to be switched, so the types of parts feeders required are significantly reduced. |
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Use of the tape joining and automatic tray component replacement function enables component replenishment during operation, thereby ensuring uninterrupted operation. |
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Two trays per plate and a total of 96 trays can be installed. |
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The cart for gang exchange of parts feeders, gang exchange support plate, and gang exchange of nozzle plates all contribute to speedy production changeover. |
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